Sunday, October 25, 2026

Samsung’s Exynos 2700 beats Qualcomm’s latest chip in performance tests; expected to power the Samsung Galaxy S27

Input
2026-10-25 09:11:42
Updated
2026-10-25 09:11:42
Samsung Electronics Co., Ltd.’s mobile AP (application processor), the “Exynos 2600.” Samsung YouTube

[Financial News] Samsung Electronics Co., Ltd.’s next-generation mobile application processor (AP), the “Exynos 2700,” which is expected to power the flagship Samsung Galaxy S27 series set to launch early next year, has reportedly outperformed Qualcomm’s latest chipset in internal performance tests.
With the chip outperforming in both CPU and GPU performance, hopes are growing that Samsung Electronics Co., Ltd. will regain its competitiveness in its own mobile APs.
According to industry sources on the 25th, Samsung Electronics Co., Ltd.’s Exynos 2700 recently scored higher than Qualcomm’s top-tier mobile AP, the “Snapdragon 8 Elite Extreme Gen 6,” in an internal benchmark test using the Xiaomi 18 Pro Max from China’s Xiaomi.
On Geekbench 6.5, the Exynos 2700 scored about 13,000 in the CPU multi-core test, roughly 20% higher than Qualcomm’s product, which scored about 11,000. It was also about 15% ahead on Geekbench 7.0. Compared with Qualcomm’s lower-tier “Snapdragon 8 Elite Gen 6,” it scored 44% and 36% higher, respectively.
The Exynos 2700 also outperformed in GPU performance. In tests measuring peak graphics processing performance in high-end gaming conditions, it scored about 20% higher than Qualcomm’s top-tier model. It was also about 5% ahead in basic graphics computation for typical high-end 3D games.
Exynos is an in-house mobile AP designed by Samsung Electronics Co., Ltd.’s System LSI Business, and is a key semiconductor responsible for computing and graphics processing in smartphones. Its predecessor, the Exynos 2600, was used in some models in the Samsung Galaxy S26 series and A New Shape Unfolds.
The next-generation Exynos 2700 is slated for mass production using the Foundry Business Division’s second-generation 2nm process (SF2P). It is also expected to use advanced Heat Path Block (HPB) packaging technology to reduce heat and improve performance.

[email protected] Im Su-bin Reporter