T-Robotics Secures U.S. Patent for Semiconductor Glass-Substrate Transfer Robot, Targets Advanced Packaging Market

[Financial News] T-Robotics, a company specializing in humanoid and industrial robots, has strengthened its foundation for entering the next-generation semiconductor packaging market by securing a U.S. patent related to robots that transfer semiconductor glass substrates.
T-Robotics said on the 21st that it had completed U.S. patent registration for technology related to robots that transfer semiconductor glass substrates. Having secured patents in the United States following Korea and Japan, the company has broadened its intellectual property base to protect core technologies in major semiconductor markets.
The patent covers technology for a device that precisely transfers substrates inside a vacuum chamber. The company is expanding the application of technologies developed through the development and supply of vacuum robots for displays into the field of semiconductor glass-substrate transfer.
Glass substrates are attracting attention in advanced packaging as demand for artificial intelligence (AI) semiconductors and high-bandwidth memory (HBM) grows. Their advantages over conventional organic-material substrates include superior flatness and thermal stability. Transfer and automation technologies that enable precise and stable handling of substrates during manufacturing are also becoming increasingly important.
T-Robotics is applying precision-control and vacuum-transfer technologies developed during the development of 8.6-generation organic light-emitting diode (OLED) transfer robots to robots that transfer semiconductor glass substrates. Its strategy is to apply its experience in reliably transferring large substrates to meet the needs of next-generation semiconductor processes.
An industry official in the semiconductor equipment sector said, "For glass-substrate transfer robots, precise positional control and technology that minimizes substrate damage during transfer are important," adding, "In addition to securing patents in major markets, validating stability and reliability in customers' processes will be key to commercialization going forward."
T-Robotics is also proceeding with patent applications for related technologies in China and Taiwan. The company plans to expand its patent portfolio with a focus on major semiconductor-producing countries and identify new business opportunities with global semiconductor manufacturers and equipment makers.
A key challenge in future commercialization is expected to be adapting transfer technologies from the display sector to the requirements of each semiconductor process. The company plans to respond to customers' technology needs and pursue market entry based on its precision-control and vacuum-transfer technologies.
A T-Robotics representative said, "The growth of the AI semiconductor and advanced packaging markets is making high-precision substrate-transfer technology increasingly important," adding, "We will actively respond to the technology needs of global semiconductor manufacturers and equipment makers and press ahead in earnest with commercializing robots for next-generation semiconductor processes."
[email protected] Choi Doo-sun Reporter