SK Nexilis Co., Ltd. develops high-adhesion copper foil for silicon anodes; commercialization planned for next year
- Input
- 2026-10-20 14:51:14
- Updated
- 2026-10-20 14:51:14
SK Nexilis Co., Ltd. said on the 20th that it had developed a technology that strengthens adhesion to anode materials by coating the surface of copper foil with a special carbon material.
The technology focuses on suppressing the “detachment” of silicon anode materials from copper foil as they expand during charging and discharging. The company said the technology could help improve battery life and safety by increasing the structural stability of electrodes.
The battery industry has recently been increasing the proportion of silicon in anode materials to boost energy density. However, as silicon content rises, securing adhesion between the anode material and copper foil becomes increasingly important to accommodate the volume changes that occur during charging and discharging.
SK Nexilis Co., Ltd. says the copper foil it has developed can also be used in dry electrode processes. Unlike conventional wet processes, dry electrode processes reduce the use of liquid solvents, which can lower the energy and manufacturing costs required for drying. Securing stable adhesion between electrode materials and copper foil is also important in dry processes.
SK Nexilis Co., Ltd. said, “We will begin setting up a pilot production system to commercialize high-adhesion carbon-coated copper foil,” adding, “We plan to secure mass-production technology going forward and pursue commercialization in the second half of next year.”
[email protected] Kim Mi-hee Reporter