Wednesday, October 14, 2026

China’s CXMT unveils next-generation DRAM technology ... Samsung Electronics also “developing it”

Input
2026-10-14 17:08:03
Updated
2026-10-14 17:08:03
Song Jae-hyuk, chief technology officer (CTO) and president of Samsung Electronics, and Rep. Lee Jun-seok of the New Reform Party look around the exhibition hall at the 28th Semiconductor Exhibition (SEDEX 2026), held at COEX in Seoul’s Gangnam District, on the 14th. Photo courtesy of Yonhap News Agency

[Financial News] Samsung Electronics said it is also developing the same technology after China’s largest semiconductor company, ChangXin Memory Technologies (CXMT), announced plans to launch next-generation DRAM for servers.
Samsung Electronics President and CTO Song Jae-hyuk answered “Yes” when reporters asked him at the 28th Semiconductor Exhibition (SEDEX 2026), held at COEX in Seoul’s Gangnam District, on the 14th, “Is Samsung Electronics also developing 4F² technology?”
Asked about the progress of development, he held back, saying, “We’re working hard.”
Earlier, 4F² was a next-generation technology that China’s CXMT said it would apply to server DRAM. Its key feature is fitting more data into the same space.
After CXMT’s announcement, some expressed concern that China’s memory semiconductor technology could catch up with South Korea. The previous day, shares of Samsung Electronics and SK hynix fell 7.4% and 10.1%, respectively.
At the exhibition, Samsung Electronics set up six exhibition spaces under the theme “AI System Design,” covering next-generation technologies, cloud AI, edge AI, physical AI, semiconductor clusters, and mutually beneficial cooperation.
Meanwhile, Rep. Lee Jun-seok of the New Reform Party also visited the venue that day and toured the exhibition booths of major semiconductor companies with President Song and Ahn Hyun, president in charge of development at SK hynix.


[email protected] Park Ji-yeon Reporter