LG Electronics Unveils Modular Solutions in Singapore, Targets AI Data Center Cooling Market

[Financial News] LG Electronics is targeting the AI data center cooling market by unveiling modular cooling infrastructure that reduces construction time and upfront investment burdens. The company plans to expand its business as an "AI infrastructure partner" supporting the entire process of designing, building and operating AI data centers.
LG Electronics is participating in Data Center World Asia (DCWA) 2026, Asia's largest data center exhibition, which opened in Singapore on the 29th. The company is showcasing a total solution for AI data centers that covers everything from thermal management to power and operations.
At the exhibition, LG Electronics unveiled its "Hydronic Modular" solution for the first time.
The Hydronic Modular solution uses a prefabricated design that integrates pumps and piping as a finished product inside an ISO-standard container. It combines numerous essential components, including pumps, valves and emergency buffer tanks, into a single unit.
At an AI data center site, the cooling system can be brought online immediately by simply connecting the Chiller unit and the container module, much like fitting blocks together. Standardized modules can be added as needed, allowing facility investment to be carried out flexibly in line with the data center's expansion plans. This reduces the construction period and upfront investment burden for AI data centers while enabling a rapid response to future demand for additional AI servers.
LG Electronics is also showcasing an air-cooled, oil-free inverter turbo Chiller optimized for AI data centers at the exhibition.
The product uses an oil-free compressor based on magnetic bearings to reduce friction losses and improve cooling efficiency. It also incorporates refrigerant free-cooling technology, which stops the compressor and allows refrigerant condensed by cool outside air to circulate naturally and dissipate heat, helping reduce energy consumption.
LG Electronics is also presenting a portfolio of core equipment, including Fan Wall Units (FWUs) that stably supply cool air inside AI data centers and efficiently exhaust heat. LG Electronics' FWUs help ensure stable server operation by delivering uniform cooling performance even in high-heat environments. The company explains that the product is suitable for hyperscale AI data centers because it provides uniform cooling to all servers while minimizing energy consumption, thereby maximizing computing capacity.
LG Electronics is also presenting a liquid cooling solution regarded as essential infrastructure for AI data centers. At the exhibition, it is showcasing 1 MW and 2.6 MW-class coolant distribution units (CDUs) that recently received approval from NVIDIA under its quality specifications.
LG Electronics also plans to continue expanding business opportunities based on its "One LG" integrated solution, which brings together the capabilities of its group affiliates in heating, ventilation and air conditioning (HVAC) solutions. The company envisions serving as a key AI infrastructure partner across every stage of a data center—from design and manufacturing to transportation, construction, operation and expansion—by jointly proposing LG Electronics' cooling technologies, LG Energy Solution's battery solutions, and LG CNS's data center design, construction and operations capabilities.
Lee Jae-sung, president and head of LG Electronics' ES Business Division, said, "We will establish ourselves as a key partner in the global AI infrastructure market by leading with a comprehensive cooling solution optimized for hyperscale AI data centers."

[email protected] Park So-hyun Reporter