LG Electronics joins forces with SK Enmove to step up its push into AI data centers
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- 2026-09-23 10:00:00
- Updated
- 2026-09-23 10:00:00

[Financial News] LG Electronics is stepping up its push into AI data centers by collaborating with SK Enmove on next-generation thermal management technologies. As the importance of highly efficient thermal management technologies grows across various industries, including AI data centers, securing competitiveness in key materials such as refrigerants and refrigeration oils—which determine the performance and efficiency of cooling systems—is becoming increasingly important. By combining the technological capabilities of LG Electronics and SK Enmove, the companies plan to establish a joint research and development system for next-generation thermal management technologies and strengthen their competitiveness in the global heating, ventilation, air conditioning and refrigeration market.
LG Electronics announced on the 23rd that it signed an MOU with SK Enmove on the 21st at the SK Seorin Building in Seoul's Jongno District for the joint preliminary development of new refrigerants, refrigeration oils and immersion cooling technologies for home appliances, commercial and industrial applications. Key officials, including LG Electronics ES Business Division President Lee Jaesung and SK Enmove President Kim Won-gi, attended the signing ceremony.
The two companies will first jointly develop next-generation refrigerants in response to global environmental regulations.
They plan to jointly carry out preliminary development and performance verification of eco-friendly, high-performance refrigerants that comply with international environmental regulations and refrigerant standards, have a GWP below 150, and are free of per- and polyfluoroalkyl substances (PFAS).
Drawing on its experience in refrigerant development and evaluation, SK Enmove will develop candidates for new refrigerants. LG Electronics will assess their practical applicability based on its experience operating air-conditioning products and systems in global markets.
The companies will also conduct joint research on refrigeration oils tailored to the characteristics of the next-generation refrigerants they develop and apply.
Refrigerants transport heat, while refrigeration oils are key materials that, like engine oil in automobiles, reduce friction and damage between major components such as compressors in heating, ventilation, air conditioning and refrigeration systems, enabling smooth and stable operation. The companies plan to secure refrigeration oils optimized for new refrigerants and heating, ventilation, air conditioning and refrigeration systems, thereby improving product performance and efficiency while strengthening cost competitiveness.
The companies will also expand their cooperation in immersion cooling technologies, which improve the power and cooling efficiency of AI data centers.
Through this partnership, LG Electronics and SK Enmove will further advance their existing cooperation on immersion cooling for AI data centers. They will also assess the potential application of immersion cooling technologies to thermal management for high-heat-generating power and electronic equipment, including energy storage systems and electric vehicle components, in addition to data centers.
SK Enmove President Kim Won-gi said, "Thermal management technology is a key factor that determines energy efficiency and product performance. Through our cooperation with LG Electronics, we will accelerate the development of next-generation refrigerants, refrigeration oils and immersion cooling technologies, while expanding commercialization opportunities across various industries."
LG Electronics ES Business Division President Lee Jaesung stated, "The importance of highly efficient thermal management technologies is rapidly growing across various industries, including AI data centers. By combining LG Electronics' differentiated air-conditioning and cooling capabilities with SK Enmove's expertise in refrigerants and refrigeration oils, we will strengthen the competitiveness of next-generation thermal management solutions and continue to identify new business opportunities in global markets."
[email protected] Park So-hyun Reporter