HANMI Semiconductor Targets AI Packaging Market Beyond HBM with First Shipment of FC Bonder 75
- Input
- 2026-09-22 11:07:58
- Updated
- 2026-09-22 11:07:58
HANMI Semiconductor announced on the 22nd that it had shipped FC Bonder 75, which supports 2.5D packaging for AI semiconductors, to a global customer for the first time.
FC Bonder 75 is equipment designed to support large interposer packages measuring 75 mm × 75 mm. It can process a larger area than conventional semiconductor packaging equipment, making it suitable for integrating the large dies required for next-generation AI semiconductors and multiple semiconductor chips into a single package.
As competition over AI semiconductor performance intensifies, the importance of advanced packaging technology is also growing. One prominent example is 2.5D packaging, which integrates different semiconductors—including central processing units (CPUs), graphics processing units (GPUs), and HBM—into a single package.
Accordingly, demand for high-specification packaging equipment is expanding, particularly among foundries and outsourced semiconductor assembly and test (OSAT) companies.
HANMI Semiconductor is expanding its lineup of 2.5D packaging equipment in response to these market changes. The company previously launched FC Bonder 3.5, 2.5D TC Bonder 40 C2S, and 2.5D TC Bonder 40 C2W, and is preparing to launch 2.5D TC Bonder 120.
With the establishment of its U.S. subsidiary, HanmiUSA, scheduled for October, HANMI Semiconductor plans to expand its engagement with global customers and accelerate the supply of advanced packaging equipment.
A HANMI Semiconductor official said, "Starting with the first shipment of FC Bonder 75, we are expanding our technological competitiveness in the AI semiconductor market by supplying customers not only with TC bonders for HBM, but also with TC bonders for AI packages and a range of other packaging equipment."
[email protected] Lee Ju-mi Reporter