SK hynix CEO Noh-Jung Kwak: "We will open new possibilities for AI with next-generation memory"

[Financial News] Noh-Jung Kwak, president and CEO of SK hynix, said the company plans to maintain its technological edge in the AI memory market by developing next-generation memory and expanding its global production and research hubs.
According to SK hynix Newsroom on the 21st, President Kwak said at the '2026 Global Forum' held in Santa Clara, California, on the 18th local time, "The AI industry cannot exist without memory. Just as we set a new milestone with High Bandwidth Memory (HBM), we will continue to open new possibilities for AI through the next-generation memory currently under development."
SK hynix has hosted the Global Forum annually since 2012 to present its technological vision and growth strategy to global experts and researchers while expanding exchanges with future talent. This year's event served as an opportunity to share the company's AI memory technology strategy and strengthen connections with global research and development talent.
SK hynix presented its technological capabilities and development roadmap, while sharing its outlook for the AI industry and strategies to address its challenges.
In his keynote speech, President Kwak outlined plans to expand production and research hubs, including the Yongin Semiconductor Cluster, an advanced packaging production base in Indiana, United States, and a global AI research and development (R&D) center in the United States.
President Kwak said, "As the AI industry's growth continues, demand for AI memory will remain strong. In line with this trend, we will firmly maintain our current technological edge and overwhelming market dominance through the new global production hubs and research infrastructure now under development."
The panel discussion, held under the theme "At a Turning Point in Technology, Opening the Next Chapter of Memory," featured Hyungsoo Kim, vice president in charge of DRAM design; Jae-won Lee, vice president in charge of AI interfaces; Kangwook Lee, vice president in charge of PKG development; and Ho-sik Kim, vice president in charge of memory systems research.
Participants predicted that as AI advances, the ability to find solutions by connecting design, process and device technologies, packaging, and systems will become increasingly important, beyond improving the performance of individual technologies. They also noted that future engineers will need expertise in specific fields, along with the ability to understand other technologies and collaborate with experts across multiple disciplines.
Bo-geon Jin, vice president and head of the corporate culture division, emphasized, "SK hynix's ability to lead the AI memory market stems from its flexible yet horizontal organizational culture. A one-team culture that brings together individual capabilities to create greater synergy, along with a culture of constantly challenging new approaches, is also the foundation of our technological competitiveness."
For the themed round tables, participants were divided into current industry experts and academic researchers, with a total of eight sessions held across four areas: design, process and devices, advanced packaging, and AI systems. The event venue also featured exhibition spaces showcasing key products, including HBM, next-generation memory solutions, and research papers by SK hynix scholarship recipients.
SK hynix said, "This Global Forum was a meaningful opportunity to directly share SK hynix's technological vision and global growth strategy with experts currently leading the AI industry and global talent who will shape future technology paradigms. We will continue to engage actively with experts in the semiconductor and AI fields and pursue technological innovation."
[email protected] Park Ji-yeon Reporter