Monday, September 21, 2026

North Gyeongsang Province Secures Semiconductor Glass Substrate Production Hub in Gimcheon-si

Input
2026-09-21 08:17:05
Updated
2026-09-21 08:17:05
A view of the North Gyeongsang Provincial Government offices. News1

[Financial News, Andong and Gimcheon-si—Reporter Kim Jang-wook] North Gyeongsang Province is set to establish a semiconductor glass substrate production hub in Gimcheon-si.
North Gyeongsang Province and Gimcheon-si signed an investment memorandum of understanding (MOU) with advanced manufacturing company JNTC at the Gimcheon City Hall auditorium on the 21st to establish a semiconductor glass substrate production line.
The investment will give Gimcheon-si a new production hub for the semiconductor and advanced manufacturing industries. The project, worth approximately 347 billion won, is expected to create about 430 jobs and contribute to revitalizing the local economy.
The province and city plan to provide administrative support to ensure the investment proceeds smoothly. They will build on their efforts to communicate with the company, from proposing a site suited to its needs and reviewing potential locations to discussing the investment.
Governor Lee Cheol-woo said, "JNTC's investment in Gimcheon-si is highly significant because it will establish in North Gyeongsang Province a next-generation glass substrate production hub that will lead the future of the AI and semiconductor industries." He added, "We will support the investment so it proceeds as planned and do our utmost to help the company and the region grow together by linking it with the local industrial ecosystem."
JNTC plans to invest approximately 347 billion won from 2027 to 2030 to establish a Through-Glass Via (TGV) glass substrate production line on industrial land in the vicinity of Gimcheon 1 General Industrial Complex (Phase 3). The company also plans to newly hire about 430 employees.
Through-Glass Via (TGV) is a technology that connects electrical signals on both sides of a glass substrate through microscopic electrodes and wiring that vertically pass through it. As demand for high-performance semiconductors grows with the expansion of artificial intelligence (AI) and high-performance computing (HPC), TGV is attracting attention as a next-generation semiconductor packaging material. JNTC plans to establish Gimcheon-si as a next-generation production hub and expand its related business.
Jang Sang-wook, chairman of JNTC, said, "This investment agreement signifies that our TGV glass substrate business, a mid- to long-term growth driver, has entered the path toward full-scale commercialization based on highly advanced technology." He added, "Backed by leading-edge technology, superior quality and cost competitiveness, we will establish ourselves as a leading advanced-materials company in the AI-driven global semiconductor market and pursue mutual growth with the Gimcheon-si community."
Meanwhile, JNTC possesses key TGV process technologies, including glass cutting, laser glass drilling, etching and plating. It operates three domestic facilities and overseas operations in Vietnam and China, producing cover glass and connectors for mobile devices, vehicles and wearable devices. The company is also preparing for mass production of new products, including TGV glass substrates and HDD glass platters.

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