SIMMTECH Participates in International Semiconductor Substrate and Advanced Packaging Industry Exhibition, Wins Three Awards Including MOTIE Minister’s Award for AI Substrate Technology

[Financial News] SIMMTECH, a company specializing in printed circuit boards (PCBs) for artificial intelligence (AI) semiconductors, participated in the International Semiconductor Substrate and Advanced Packaging Industry Exhibition (KPCA Show 2026), which opened on the 9th at Songdo Convensia in Incheon as the largest event in its history. The company also demonstrated its standing in the industry as three employees received awards for their contributions to industrial development.
Hosted by the Korea PCB Semiconductor Packaging Industry Association, KPCA Show 2026 is a global business-to-business (B2B) exhibition designed to promote the growth of the domestic and international semiconductor packaging and next-generation substrate industries while sharing the latest technology trends.
At the exhibition, SIMMTECH introduced a range of products and solutions aimed at leading the market, focusing on high-layer-count, ultra-thin, ultra-fine and large-area semiconductor substrate technologies for AI and next-generation computing environments. Key exhibits included the next-generation SOCAMM memory module for AI servers, targeting the next-generation AI server and high-performance mobile and server markets; the next-generation low-power LPCAMM memory module; the Enterprise SSD Module; and the CXL Memory Module.
At the reception awards ceremony held on the opening day, SIMMTECH employees received awards in three categories in recognition of their contributions to the development of Korea’s semiconductor packaging and substrate industries.
Park Min-ho, an executive director who led the successful establishment of a mass-production system for SIMMTECH’s next-generation advanced product, SOCAMM, was selected as the top award recipient and received the Minister of Trade, Industry and Energy’s Award. Park was highly recognized for enhancing the global competitiveness of the AI semiconductor supporting industry and contributing to the stabilization of the domestic supply chain.
Jeon Young-sun, chief executive officer (CEO), received the Proud PCB Semiconductor Packaging Achievement Award for his dedication to the globalization of the industry. Yoo Jong-sang, a senior principal engineer who led technological innovation in the field, received the Proud PCB Semiconductor Packaging Industry Professional Award. Through these honors, SIMMTECH demonstrated industry-leading human and technological capabilities across the organization, from management to frontline technical personnel.
A SIMMTECH representative said, "Our participation in this event and three-award haul demonstrate that SIMMTECH’s technological leadership in the next-generation semiconductor substrate market has been officially recognized." The representative added, "We will further expand our investment in next-generation advanced packaging substrate technologies, including AI-focused SOCAMM module substrates and high-layer-count MSAP substrates, while strengthening strategic partnerships with global semiconductor manufacturers to solidify our position among the global market leaders."
[email protected] Choi Doo-sun Reporter