LG Innotek Unveils AI Semiconductor Substrate Technology at KPCA Show... Flip Chip Ball Grid Array (FC-BGA) Mass Production Next Year

[Financial News] LG Innotek announced on the 9th that it is participating in the International Semiconductor Substrate & Advanced Packaging Industry Exhibition (KPCA Show 2026), held at Songdo ConvensiA in Incheon Metropolitan City until the 11th, to showcase next-generation substrate technologies and products.
The KPCA Show, marking its 23rd edition this year, is the largest specialized exhibition for PCBs and semiconductor packaging in Korea, hosted by the Korea Electronics Packaging and Circuits Association (KPCA). Over 350 domestic and international companies participate to share the latest technological trends.
LG Innotek is showcasing innovative products and technologies in the fields of 'package substrates' and 'tape substrates,' as well as Flip Chip Ball Grid Array (FC-BGA), for which demand is surging in the era of artificial intelligence (AI). LG Innotek is expanding its package solution business. In the first half of this year, sales reached 935.6 billion won and operating profit 99.6 billion won, representing increases of 18% and 94%, respectively, compared to the previous year. The operating profit margin also rose from 6.5% to 10.6%, demonstrating both growth potential and profitability. LG Innotek plans to establish the package solution business as a core future growth engine and cultivate it to an operating profit scale of 1 trillion won by 2031.
At this exhibition, LG Innotek is unveiling its FC-BGA for AI accelerators for the first time. FC-BGA is a high-specification semiconductor substrate that connects semiconductor chips to motherboards. Since the FC-BGA for AI accelerators is applied to high-performance semiconductors such as GPUs and NPUs that rapidly process large amounts of data, it must accommodate more circuits and components than a standard FC-BGA. Accordingly, high circuit integration and large-area design technology are required.
The FC-BGA for AI accelerators unveiled this time is a large-area substrate with a side length exceeding 100 mm. It incorporates core technologies, such as ultra-fine circuit implementation and high multi-layering, that LG Innotek has accumulated over the past 50 years through its substrate business. The company aims to mass-produce high-value FC-BGAs for AI learning and inference, including AI accelerators, next year.
In addition, during the exhibition, LG Innotek plans to showcase not only large-area 85mm x 85mm FC-BGA substrates but also samples of ultra-large area FC-BGA substrates with an area increased by approximately 40%.
LG Innotek is also showcasing innovative technologies that demonstrate its differentiated competitive edge in FC-BGA. Chip embedding technology is a prime example. Unlike the conventional method of mounting chips on the surface of a substrate, this technology places the chip inside the substrate to minimize the connection distance between the chip and the board. This enhances signal transmission performance while reducing power loss by lowering electrical resistance.
We also introduce glass substrate technology, which is attracting attention as a next-generation packaging solution optimized for FC-BGA. Glass substrates have the advantage of minimizing substrate warping and circuit distortion by replacing the internal core layer with glass. LG Innotek is accelerating technology development with the goal of mass production of glass substrates by 2028.
In addition, the Package Substrate Zone will showcase the world's No. 1 RF-SiP substrate, which embodies LG Innotek's proprietary technology, and FC-CSP substrates, whose demand has diversified to high-performance memory semiconductors such as Graphics Double Data Rate (GDDR) due to the spread of inference-based AI.
In the tape substrate sector, the company is showcasing display substrates and 'ECONOVA,' a next-generation smart IC substrate. 'ECONOVA' is the world's first smart IC substrate incorporating eco-friendly new materials capable of achieving high performance without the need for precious metal plating processes such as palladium or gold. By simultaneously meeting environmental regulations and product performance requirements, it is garnering significant interest, particularly in the European market.
"This exhibition will allow visitors to intuitively see how LG Innotek's substrates are utilized in various industries and daily life, including AI, smartphones, and mobility," said Cho Ji-tae, Executive Vice President and Head of the Package Solution Business Division. "We will change the paradigm of the substrate market by leading with innovative products."
[email protected] Im Soo-bin Reporter