“Targeting Taiwan’s Packaging Market,” HANMI Semiconductor Participates in SEMICON Taiwan

[Financial News] HANMI Semiconductor is seeking to expand its presence in the global semiconductor equipment market by participating in an overseas exhibition.
According to industry sources on the 2nd, HANMI Semiconductor set up a booth at SEMICON Taiwan 2026, which opened that day in Taipei. The company is also serving as an official sponsor of SEMICON Taiwan for the 12th consecutive year through this year.
SEMICON Taiwan is Taiwan’s largest semiconductor industry exhibition, organized by Semiconductor Equipment and Materials International (SEMI). This year’s event is the largest ever, with around 1,300 semiconductor companies from around the world participating and operating approximately 4,300 booths. Taiwan is home to the headquarters of leading semiconductor back-end companies, including Advanced Semiconductor Engineering (ASE) and SPIL.
At the exhibition, HANMI Semiconductor unveiled advanced semiconductor back-end packaging equipment for the Taiwan market, including 2.5D thermal-compression equipment (TC bonders) for artificial intelligence (AI) system semiconductors and TC bonders for high-bandwidth memory (HBM).
Specifically, the company displayed five types of bonders: the 2.5D FC Bonder 3.5, FC Bonder 75, 2.5D TC Bonder 40 C2S, 2.5D TC Bonder 40 C2W, and 2.5D TC Bonder 120. Among them, the FC Bonder 3.5, FC Bonder 75, 2.5D TC Bonder 40 C2S, and C2W were launched sequentially starting late last year and are being actively supplied to global semiconductor foundries and back-end companies.
The 2.5D TC Bonder 120 is also set to be launched soon. HANMI Semiconductor continues to hold the global No. 1 position in the HBM TC bonder market. Recently, it expanded into the system semiconductor TC bonder sector, further strengthening its position in the advanced semiconductor back-end equipment market.
HANMI Semiconductor also plans to unveil the TC Bonder 4 for HBM4 production and the next-generation Wide TC Bonder at the exhibition.
A HANMI Semiconductor representative said, “SEMICON Taiwan is a global semiconductor event where AI semiconductor technologies converge. We will lead the growth of the semiconductor market by expanding supplies of advanced equipment not only in the globally leading HBM TC bonder market but also in the system semiconductor market.”
Meanwhile, HANMI Semiconductor recently decided to invest an additional 130 billion won to build its eighth plant, taking preemptive steps to meet rising demand for semiconductor equipment such as TC bonders. The company purchased a 20,595-square-meter plot of land in the Juan National Industrial Complex in Incheon from Mercury. It plans to build its eighth plant there, following its hybrid bonder factory, the seventh plant.

[email protected] Reporter Kang Kyung-rae Reporter