LG Chem to Expand Semiconductor Materials Business, Broadens Client Base at SEMICON Taiwan

[Financial News] LG Chem Ltd. is stepping up efforts to strengthen its advanced packaging and power semiconductor materials business as demand grows in the AI semiconductor and high-bandwidth memory (HBM) markets. At Asia's largest semiconductor exhibition, the company plans to showcase a wide range of related materials and secure new customers among global chipmakers and back-end process and packaging companies.
LG Chem Ltd. said on the 26th that it will take part in SEMICON Taiwan 2026, which will be held from Sept. 2 to 4 at the Taipei Nangang Exhibition Center (TaiNEX) in Taipei, Taiwan.
SEMICON Taiwan is Asia's largest semiconductor exhibition, covering next-generation technologies such as advanced packaging and AI semiconductors. Semiconductor makers, OSAT companies, and substrate and packaging firms will attend to discuss technology and business cooperation.
LG Chem Ltd. will set up an exhibition booth on the fourth floor of Hall 2 at TaiNEX and unveil semiconductor material solutions aimed at the AI semiconductor and High-performance computing (HPC) markets.
The focus is on advanced packaging materials for AI semiconductors. In the 'Advanced Packaging Zone,' the company will showcase Copper Clad Laminate (CCL), glass core solutions, build-up film, and film-type solder resist (DFSR). It will also display materials used in advanced packaging processes, including photosensitive insulating material (PID), Die attach film (DAF), bonding and debonding solutions, and stripping agents for fine processes.
In the 'Power Package Zone,' it will present conductive sintering paste, thermal interface material (TIM), and thermal management device solutions based on copper metal foam. These materials help improve the efficiency of power semiconductors, manage heat effectively, and enhance semiconductor performance.
LG Chem Ltd. plans to use the exhibition as an opportunity to expand contact with global customers. It aims to broaden its customer base in the AI semiconductor and advanced packaging markets by increasing technical exchanges with major chipmakers, OSAT companies, and substrate and packaging firms, while also identifying new projects.
Kim Dong-chun, president of LG Chem Ltd., said, "As the AI semiconductor and advanced packaging markets expand, customer demand for high-performance materials is rising." He added, "Based on our differentiated materials portfolio, LG Chem will expand cooperation with semiconductor customers and actively secure growth opportunities in the future semiconductor market."
[email protected] Lee Dong-hyeok Reporter