Samsung Electronics Seizes Early Lead in HBM4 Revenue 'Billion-Dollar Milestone'... Expands NVIDIA Share

Input: 2026-06-23 09:33:30

Updated: 2026-06-23 09:33:30

Jensen Huang, CEO of NVIDIA, and Jun Young-hyun, head of Samsung Electronics' Device Solutions Division (DS Division), pose for a commemorative photo after meeting at The Shilla Seoul in Jung-gu, Seoul, on the 8th to discuss supplies of HBM4E and HBM5.

Provided by Samsung Electronics [Financial News] Samsung Electronics' latest sixth-generation high-bandwidth memory, HBM4 (High Bandwidth Memory 4), has become the first in the industry to surpass $1 billion in revenue. According to the industry on the 23rd, Samsung Electronics' HBM4, which was mass-shipped for the first time in the world on Feb. 12, surpassed $1 billion in sales in about four months.

2 billion. Supply is expanding at a rapid pace. If the trend continues, revenue could reach $10 billion by year-end.

Samsung Electronics said such a figure would be unprecedented for a memory product in its first year of mass production. The company is currently believed to be rapidly expanding its share of the HBM4 market, led by NVIDIA. Analysts say the surge in Big Tech investment in artificial intelligence infrastructure has also boosted demand for HBM4, which is used in cutting-edge AI accelerators.

The World Semiconductor Trade Statistics (WSTS) forecast that the global semiconductor market will reach $975 billion this year. 6 billion, according to industry estimates. Samsung Electronics expects its HBM revenue to more than triple this year, helped by a broader customer base.

Samsung Electronics' world-first HBM4E 12-layer product. Newsis Samsung Electronics said on the 29th of last month that it would begin supplying samples of its 'HBM4E 12-layer' product, which is expected to become a core component of next-generation AI accelerators, to global customers. The photo shows Samsung Electronics' HBM4E 12-layer product being shipped to a global customer for the first time in the world.

Provided by Samsung Electronics Kim Dong-won, a researcher at KB Securities, said, "Samsung Electronics, which has secured a diversified customer base centered on ASIC makers such as Broadcom, Google, Amazon. com, Inc. , Microsoft, and Meta, is expected to see a sharp increase in HBM shipments next year.

" Samsung Electronics secured a competitive edge in performance and mass-production stability by applying a 4-nanometer advanced process to the base die of its HBM4 memory. It launched the world's first mass shipment of HBM4 in February to take the lead in the next-generation AI memory market. 7Gbps, about 46% faster than the industry standard, easing data bottlenecks that worsen as AI models grow larger.

7 times the data transfer capacity of the previous generation, exceeding customer requirements. In addition, power efficiency has improved by about 40% from the previous generation, giving it both performance and lower operating costs. Samsung Electronics plans to build on its technological edge in HBM4E as well.

As the world's only integrated device manufacturer (IDM) with capabilities in logic IC, memory, foundry, and semiconductor packaging, the company can provide a one-stop service from design to packaging. Industry observers say Samsung Electronics' ability to optimize its own foundry process and HBM design together will become a powerful competitive advantage as HBM becomes more advanced. An industry source said, "Because HBM4 and the next-generation HBM4E products are expected to become mainstream through 2030, Samsung Electronics is likely to hold the upper hand in future HBM competition.

ehcho@fnnews.com Jo Eun-hyo Reporter

· This article has been translated by GripLabs Mingo AI.

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