Samsung Electronics Supplies Industry-First HBM4E 12-Stack Samples, Strengthening AI Memory Leadership
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- 2026-05-29 08:19:57
- Updated
- 2026-05-29 08:19:57

[Financial News] Samsung Electronics announced on the 29th that it has begun supplying samples of its 'High Bandwidth Memory (HBM)4E 12-stack' to global customers, becoming the first in the world to do so. The product is expected to play a key role in next-generation artificial intelligence (AI) accelerators.
\r\nSamsung Electronics explained that it had already set a market milestone in February by successfully shipping HBM4, which delivers the industry's fastest speed in mass production. Just a few months later, it has now started supplying next-generation HBM4E, once again proving its unrivaled technological leadership in the high-bandwidth memory market.
The HBM4E supply is expected to do more than simply expand the product lineup. It is also seen as a step that will solidify Samsung Electronics' unmatched supply capabilities and technological edge in the global AI infrastructure market, which is expected to grow explosively over the next several years.
Samsung Electronics' HBM4E achieves standout specifications through design and process optimization. It supports operating speeds per pin from 14Gbps to as high as 16Gbps, more than 20% faster than the previous HBM4. By delivering bandwidth of 3.6 terabytes per second in a single stack, it is also designed to maximize computing speed for large language models (LLM) and next-generation AI systems.
In particular, the company applied 1c DRAM, a 10-nanometer-class sixth-generation process already proven in HBM4, along with its in-house foundry 4-nanometer logic die. The same process was used to build the logic die in HBM4E. Samsung said this maximizes the stability of advanced process technology while securing yield and mass-production readiness, creating a formidable barrier to entry that rivals cannot easily match. By integrating low-power design and packaging optimization technologies, the company also improved energy efficiency by 16% and thermal resistance by more than 14% compared with the previous generation.
Samsung Electronics plans to begin mass production and supply in line with customer schedules, starting with this sample shipment. Hwang Sang-jun, Vice President of the Samsung Electronics Memory Business Division, said, "Following the successful mass production of HBM4, we have now completed the sample supply of next-generation HBM4E without disruption, clearly imprinting Samsung Electronics' unrivaled technological leadership on the market." He added, "Going forward, we will strongly lead the growth of the global AI memory market based on overwhelming technological differentiation and proactive investment in production infrastructure."
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soup@fnnews.com Lim Su-bin Reporter