Thursday, March 26, 2026

[Exclusive] AMD CEO Lisa Su to Hold Separate Meeting With Samsung DX Chief Roh Tae-moon

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2026-03-17 14:40:00
Updated
2026-03-17 14:40:00
Lisa Su, chief executive officer of Advanced Micro Devices (AMD), delivers a keynote speech at the Consumer Electronics Show 2026 (CES 2026) held in Las Vegas in January. Yonhap News

[Financial News] Lisa Su, CEO of Advanced Micro Devices (AMD), who will visit Korea on the 18th, has been confirmed to hold a separate one-on-one meeting not only with Samsung Electronics' semiconductor Device Solutions Division (DS), but also with Roh Tae-moon, head of the Samsung Electronics DX Division. Market watchers say the two companies are likely to broaden their collaboration beyond semiconductors into finished products, which could significantly expand the scope of their partnership.
According to industry sources on the 17th, Lisa Su is scheduled to visit the Samsung Town Headquarters in Seocho, Seoul, on the 19th after arriving in Korea and hold a meeting with Roh, the head of the DX Division. As AMD is a major manufacturer of graphics processing units (GPU) used in finished products such as PCs handled by the DX Division, the two sides are expected to discuss potential cooperation on AI PCs and strategies to strengthen competitiveness in premium mobile devices. In particular, as on-device AI becomes more widespread and computing performance within devices grows in importance, observers expect the technological touchpoints between the two companies to expand further.
The AMD CEO’s visit is also expected to further solidify the two companies’ alliance in the semiconductor sector. On the 18th, Su plans to tour production lines at the Samsung Electronics Pyeongtaek Campus together with key semiconductor executives, including Jeon Young-hyun, head of the Device Solutions Division, and President Han Jinman.
During this trip, Su is expected to discuss expanding cooperation with Samsung Electronics beyond memory into the foundry business. Since last year, Samsung Electronics has been supplying HBM3E high-bandwidth memory for AMD’s latest AI accelerator, maintaining a steady partnership in the memory segment.
As Samsung Electronics’ foundry competitiveness has recently strengthened, there is growing speculation that AMD may use Samsung’s most advanced process nodes to manufacture its next-generation AI chips. During Nvidia’s annual GPU Technology Conference (GTC), it was revealed that Samsung’s foundry is producing Language Processing Unit (LPU) chips for the next-generation NVIDIA Vera Rubin platform. Industry watchers say that if Samsung also secures AMD as a foundry customer, it would be a positive signal for the foundry business to turn profitable.
soup@fnnews.com Reporter Lim Soo-bin Reporter