SK Hynix Showcases HBM4 and Other AI Memory Products at MWC 2026

[The Financial News] SK Hynix announced on the 5th (local time) that it is taking part in Mobile World Congress 2026 (MWC 2026), held at Fira de Barcelona Gran Via in Barcelona, Spain, through the 5th. The company is showcasing its artificial intelligence (AI) capabilities and key memory solutions, while also discussing collaboration opportunities with partners in the mobile industry.
Mobile World Congress (MWC) is the world’s largest trade show in the mobile sector, organized by the GSM Association (GSMA). While it has traditionally focused on mobile technologies, this year’s event has expanded its scope to include AI, semiconductors, and automotive electronics.
SK Hynix designed its exhibition space around the circular shape of a semiconductor wafer, the starting point of chip production, and presented world-class memory semiconductor technologies that will drive the AI era. The first-floor main exhibition area is divided into four zones: high-bandwidth memory (HBM), AI data center memory, on-device AI memory, and automotive memory. The second floor is used as meeting rooms and a lounge.
In the HBM zone, the company unveiled its sixth-generation HBM4 high-bandwidth memory (HBM4), designed for next-generation AI data center server platforms, as well as HBM3E 12-Hi, which is already being used in graphics processing unit (GPU) modules for leading global customers’ latest AI data center servers.

HBM4 incorporates 2,048 I/O channels in HBM4, delivering 2.54 times the bandwidth of the previous generation. It also improves power efficiency by more than 40%, making it a highly suitable solution for ultra-high-performance AI computing.
In the AI data center memory zone, SK Hynix showcased DDR5-based modules targeting data center and server markets, along with enterprise solid-state drive (eSSD) products that offer high capacity and high performance. The company also exhibited SOCAMM2 192GB, a next-generation memory module that combines the low-power characteristics of LPDDR5X (Low Power Double Data Rate 5X) with high-performance AI modules to deliver greater energy efficiency.
Beyond memory alone, SK Hynix used this exhibition to highlight its technological strengths in the automotive electronics sector, including on-device AI, autonomous driving, and connected cars.
In the on-device AI memory zone, the company drew attention by presenting Low-Power Double Data Rate 6 (LPDDR6), the latest product in its LPDDR lineup. In the auto zone, it showcased a wide range of products, including Automotive LPDDR6 for advanced autonomous driving, Auto/Robotics LPDDR5, Auto/Robotics LPDDR5X, Auto UFS 3.1, and Auto eMMC 5.1.

“Through MWC 2026, we have presented a wide range of memory solutions spanning AI infrastructure, on-device applications, and automotive electronics, and created an opportunity for visitors to directly experience our brand value and vision,” SK Hynix stated. The company added, “We will continue to stay one step ahead in a rapidly changing environment, dedicating ourselves to technology development so that we can remain a leading player in the global semiconductor market in the coming AI era.”
one1@fnnews.com Jung Won-il Reporter