DEEPX demonstrates AI chip before President Lee in Singapore: "Leading Physical AI"

[Financial News] DEEPX announced on the 2nd that it took part as the sole participant in the "Korea-Singapore AI Connect Summit" and conducted a technology demonstration in front of President Lee Jae Myung.
The event was co-hosted by the Ministry of Science and ICT, the Ministry of SMEs and Startups, and the Ministry of Digital Development and Information (MDDI) of Singapore to discuss ways to strengthen global AI cooperation. In the "AI Innovation Showcase" session, DEEPX presented core technologies and commercialization cases of Physical AI, in which everyday devices can think and move autonomously.
Kim Nok-won, CEO of DEEPX, demonstrated the company’s AI semiconductor technology installed in a Hyundai Motor Company robot that is scheduled for commercialization this year. He showed how the robot serves as a "safety brain" by recognizing people in real time in complex environments to prevent collisions, and introduced on-device artificial intelligence that identifies customers’ faces within the robot itself so it can operate even when disconnected from data centers or the cloud.
DEEPX has decided to mass-produce "Edge Brain," an on-device AI chip for robots jointly developed with Hyundai Motor Group. This chip is a key semiconductor that locally handles perception, decision-making, and control for robots, and Hyundai plans to apply it to various robotics solutions in hospitals, hotels, and other settings.
On the same day, DEEPX also staged a "butter demo" to showcase the capabilities of its ultra-low-power chip DX-M1, which delivers graphics processing unit (GPU)-level performance while consuming less power. In the demonstration, butter was placed on AI semiconductors performing the same AI computations, and only the butter on the DEEPX chip did not melt, illustrating its energy efficiency and heat management technology.
Kim said, "We have formed a partnership with Baidu, a global AI platform company with more than 10 million developers worldwide, to supply DEEPX chips for robots, drones, and factory automation devices," adding, "We have signed a supply contract for 40,000 AI semiconductors as our first mass-production project, with mass production scheduled for this year." In Korea, DEEPX solutions have already been adopted for POSCO DX’s factory automation, Hanjin Express’s delivery automation, and smart city systems.
The company is also accelerating its global expansion. In Singapore, DEEPX is in talks to apply low-power, field-deployed AI to public safety and smart city projects, building on cooperation opportunities with the Home Team Science and Technology Agency (HTX) under the Ministry of Home Affairs and with ST Engineering. In Latin America and Indonesia, it is working with local systems integration companies to carry out on-device AI pilot projects and joint proposals for digital transformation initiatives in the public sector.
Speaking before President Lee Jae Myung, CEO Kim Nok-won stated, "DEEPX is already recognized by the international community as a leading global Physical AI semiconductor company, having won five CES Innovation Awards, been invited to the World Economic Forum Annual Meeting in Davos, and received the MINDS Prize from the World Economic Forum (WEF) for AI technologies that change the world." He continued, "By localizing core AI semiconductor technologies, we will go all out to make Korea a world leader in Physical AI."
kaya@fnnews.com Choi Hye-rim Reporter