Samsung, SK hynix and Micron race to secure cleanrooms to boost memory supply [fn Market Watch]

According to The Financial News, the so-called "big three" that lead the global memory semiconductor market—Samsung Electronics, SK hynix and Micron Technology—are betting heavily on securing cleanrooms to cope with surging demand for artificial intelligence (AI) chips. With analysts expecting continued shortages of HBM (high-bandwidth memory) and next-generation dynamic random-access memory (DRAM), the key battleground has shifted from simply building factory shells to seeing who can secure the core production space—the cleanroom—fastest.
As of the 25th, Samsung Electronics is accelerating its "Shell First" strategy, which calls for building cleanrooms ahead of market demand, according to investment bank and industry sources.
Samsung Electronics has reportedly decided to move up the construction of the cleanroom for the P5 semiconductor production line at Samsung Electronics' Pyeongtaek Campus, its fifth production line there, to the third quarter of this year—more than six months earlier than originally planned. As a result, the target start of mass production is also expected to be brought forward from early 2028 to the end of 2027.
Samsung plans to apply a fast-track construction method that carries out structural work and utility installation (gas and chemical facilities) in parallel. The company aims to build a foundation that will allow it to respond immediately to soaring demand for next-generation products such as HBM4.
SK hynix is also making timely supply its top priority and is pouring resources into securing new cleanrooms to ease HBM shortages caused by exploding AI chip demand. At the SK hynix Cheongju Campus, the company has moved up completion of the new cleanroom, known as Phase 4, at its M15X fab by about one month from the original schedule, stepping up efforts to expand HBM supply. Phase 4 is now expected to be completed and opened in March instead of April. This follows the decision to advance the start of operations for the first cleanroom, Phase 3, to this month (February), and reflects the company’s push to bring subsequent lines online early. In addition, SK hynix is racing to shorten the construction timeline for the first fab at the Yongin Semiconductor Cluster, with the goal of starting operations in May 2027.
Micron Technology, meanwhile, has countered with a brownfield development strategy, acquiring an existing plant to overcome the time constraints of building a new facility from scratch.
Last month, Micron Technology finalized the acquisition of the P5 fab in Tongluo Township, Miaoli County, Taiwan, from foundry company Powerchip Semiconductor Manufacturing Corporation (PSMC) for about 2 billion dollars (approximately 2.65 trillion won).
The plant already has a fully built cleanroom infrastructure for 300 mm wafer production, allowing Micron to bring forward the start of mass production by more than a year compared with constructing a new facility.
Leveraging this, Micron Technology plans to ramp up shipments of next-generation DRAM and HBM from the second half of 2027, aiming to expand its market share.
One key reason the three major memory chipmakers are so focused on securing cleanrooms is the growing complexity of next-generation semiconductor manufacturing. For cutting-edge products such as sixth-generation HBM (HBM4), higher stacking and more granular process steps mean that producing the same output volume requires far more cleanroom floor space than for previous-generation products.
An industry insider noted, "Right now, a key issue for the memory sector is not only technological capability but also securing supply visibility," adding, "The battle to secure cleanrooms is more than just facility investment; it is a survival strategy to avoid falling behind in the race for dominance in AI semiconductors."


kakim@fnnews.com Kim Kyung-ah Reporter