Saturday, December 20, 2025

"DDR5 Capacity and Era Transformed"... SK hynix Leads AI Memory Market with 256GB Module

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2025-12-18 14:00:21
Updated
2025-12-18 14:00:21
SK hynix's fifth-generation (1b) 32-gigabit (Gb) based 256-gigabyte (GB) Double Data Rate 5 Synchronous Dynamic Random-Access Memory (DDR5) Registered Dual Inline Memory Module (RDIMM). Provided by SK hynix.

SK hynix announced on the 18th that it has become the first in the industry to have its 256GB DDR5 Registered Dual Inline Memory Module (RDIMM), built on 10nm-class fifth-generation (1b) 32-gigabit DRAM, certified for the Intel Xeon 6 platform. This marks a technological advancement over previous products using 16Gb chips, significantly enhancing both the AI applicability and energy efficiency of the 256GB module.
RDIMM is a memory module for servers and workstations, equipped with a register or buffer chip that relays signals between the memory controller and DRAM, making it ideal for handling large volumes of data.
The certification was granted after multiple tests at Intel Corporation's Advanced Data Center Development Lab (ADL) in the United States. Earlier this year, SK hynix also received certification for its 256GB DDR5 module based on fourth-generation (1a) 16Gb chips. With this latest achievement, the company has further strengthened its leadership in the high-capacity DRAM sector.
SK hynix developers stated, "The 256GB DDR5 module improves AI inference performance by approximately 16% compared to 128GB products, while reducing power consumption by up to 18%, thereby enhancing energy efficiency." They added, "As a memory solution optimized for AI servers, we will proactively meet the needs of data center and cloud customers."
Sangkwon Lee, Vice President of SK hynix, emphasized, "Through the certification of high-capacity DDR5, we have once again demonstrated our technological leadership in the server DRAM market. As a full-stack AI memory creator, we will continue to expand our product portfolio to meet the demand for high performance and low power consumption."
Intel Corporation also highly valued the significance of this collaboration. Dimitrios Ziakas, Vice President of Platform Architecture at Intel Corporation, commented, "Through the cooperation between our two companies, we have elevated the technological completeness of high-capacity modules. This will make a significant contribution to securing performance and efficiency in response to the increasing AI workload."
Meanwhile, SK hynix plans to leverage this certification to expand collaborations with global data center companies and respond swiftly to next-generation memory demand, aiming to maintain its leadership in the AI memory era.

moving@fnnews.com Lee Dong-hyuk Reporter