HANMI Semiconductor Receives Top Supplier Award from Micron in the United States

[Financial News] HANMI Semiconductor Co., Ltd. announced on the 17th that it has received the 'Top Supplier' award from the U.S. semiconductor company Micron Technology, Inc.
Each year, Micron Technology, Inc. hosts the Micron Supplier Awards to recognize outstanding global partners for achievements in quality, technological innovation, service, and collaboration. This year's event took place on the 13th at The Westin St. Francis San Francisco on Union Square.
HANMI Semiconductor continues to lead the global market in Thermo-Compression Bonder (TC Bonder) equipment, which is essential for the production of High Bandwidth Memory (HBM), a core component of AI semiconductors. Since 2002, the company has focused on strengthening its intellectual property rights and has filed 130 patents related to TC Bonder to date.
In May, HANMI Semiconductor launched the 'TC BONDER 4,' a device designed for the mass production of the next-generation AI memory, HBM4. Additionally, following the establishment of Hanmi Semiconductor Taiwan Corporation in 2016, the company set up a Singapore subsidiary in October this year to enhance on-site support for Micron Technology's local plants.
Recently, Micron Technology has been achieving record-breaking results and setting new market capitalization highs, fueled by the growth of the AI semiconductor market. HANMI Semiconductor's TC Bonder is regarded as playing a key role as Micron Technology expands its HBM production.
Kwak Dong-shin, Chairman of HANMI Semiconductor, stated, "There is an old saying: 'A true gentleman fulfills his responsibilities for those who recognize his worth.' We will continue to provide Micron Technology with the best service and advanced technology, and strive to maintain a strong partnership."

butter@fnnews.com Kang Kyung-rae Reporter