[Conference Call] Samsung Electronics Completes Development of HBM4 and Ships Samples, Incorporating Customer-Requested Performance in Advance

[Financial News] During its third-quarter earnings conference call on the 30th, Samsung Electronics announced, "In the third quarter of this year, sales volume of high bandwidth memory (HBM) chips expanded to the mid-80% range compared to the previous quarter, and all legacy HBM products have now shifted to HBM3E (High Bandwidth Memory 3E)."
The company further stated, "Demand for HBM is increasing at a faster pace than supply, and we are expanding mass production sales of HBM3E to all of our customers."
Recently, among HBM clients such as Nvidia, intensifying competition in graphics processing unit (GPU) performance has led to revised plans and a demand for higher-performing High Bandwidth Memory 4 (HBM4) products. Samsung Electronics explained, "We have already completed development of HBM4 and shipped samples to all customers. From the outset of HBM4 development, we anticipated these market needs and created products that exceed customer expectations. The delivered samples can fully satisfy performance requirements of over 11Gbps with low power consumption."
soup@fnnews.com Im Soo-bin Reporter