Participation in Korea's Largest Semiconductor Packaging Exhibition LG Innotek... Showcasing Next-Generation Technology

[Financial News] LG Innotek announced on the 3rd that it will participate in the 'International Advanced Semiconductor Substrate and Packaging Industry Exhibition' (KPCA Show 2025) held at Incheon Songdo Convensia until the 5th, showcasing next-generation substrate technology and products. This event, now in its 22nd year, is the largest specialized exhibition for printed circuit boards (PCB) and semiconductor packaging in Korea, hosted by the Korea PCB & Semiconductor Packaging Industry Association (KPCA). More than 240 domestic and foreign companies are participating to share the latest technology trends.
LG Innotek is exhibiting innovative products and technologies such as the next-generation mobile semiconductor substrate technology 'Copper Post' (copper pillar), high-value semiconductor substrates 'Flip Chip Ball Grid Array' (FC-BGA), and 'Package Substrate'. LG Innotek has prepared a highlight zone at the very front of the exhibition booth to showcase the world's first successful development of Copper Post technology. Copper Post technology is a technique of erecting small copper pillars on a semiconductor substrate and placing solder balls on top to connect the substrate and the mainboard.
According to LG Innotek, this technology can minimize the area and size compared to the existing method of directly attaching solder balls to the substrate. Therefore, more circuits can be arranged on the semiconductor substrate compared to the existing method, and the substrate size can be reduced by up to 20%.
LG Innotek's next-generation semiconductor component growth engine FC-BGA can be found in the highlight zone. FC-BGA, which applies proprietary technologies such as fine patterning and ultra-small via (circuit connection hole) processing technology, is a high-performance substrate that connects high-density semiconductor chips and mainboards. LG Innotek will unveil for the first time a model that allows checking the internal structure of FC-BGA, along with a 118mm x 115mm large-area FC-BGA sample for artificial intelligence (AI) and data centers.
In the next-generation substrate innovation technology zone, core technologies of FC-BGA such as multilayer core (MLC) substrate technology and glass substrate technology are introduced. LG Innotek applied MLC technology, which is designed in a multilayer structure by stacking multiple insulating layers above and below the core layer. This makes the core layer more robust, preventing warping, while allowing fine patterns to enhance signal efficiency, according to LG Innotek.
Efforts to secure glass substrate technology are also actively underway. LG Innotek is accelerating preparations for the production of glass substrate prototypes by the end of this year, aiming for mass production between 2027 and 2028. Kang Min-seok, head of LG Innotek's substrate materials business division, said, "Through the copper post and other innovative substrate technologies and products showcased at this exhibition, LG Innotek will provide differentiated value to customers." kjh0109@fnnews.com Kwon Jun-ho Reporter