Samsung Electro-Mechanics Showcases Technology at Korea's Largest Semiconductor Packaging Exhibition

[Financial News] Samsung Electro-Mechanics announced on the 3rd that it will participate in the 'International Advanced Semiconductor Substrate and Packaging Industry Exhibition' (KPCA Show 2025) held at Songdo Convensia, Incheon until the 5th, showcasing next-generation package technologies such as AI, server, automotive semiconductor package substrates, and glass core package substrates. This event is Korea's largest printed circuit board (PCB) and semiconductor packaging exhibition, where domestic and foreign substrate, material, and equipment companies participate to share the latest technology trends in the electronic circuit industry. The semiconductor package substrate (FCBGA) is a product that connects high-density semiconductor chips and mainboards to transmit electrical signals and power. According to Samsung Electro-Mechanics, FCBGA is becoming a key differentiator in semiconductor performance as the industry paradigm shifts towards servers, AI, cloud, and automotive.
Samsung Electro-Mechanics will operate booths with two themes at this exhibition: Advanced Package Substrate Zone and AI and Automotive Package Substrate Zone. In the center of the exhibition booth, a product disassembly diagram with semiconductor package substrates is placed to enhance visitors' understanding.
In the Advanced Package Substrate Zone, the core technology of high-end AI and server FCBGA currently in mass production is showcased. This product features the highest level of specifications, with an area 10 times larger and internal layers 3 times more than general FCBGA. Samsung Electro-Mechanics is the only company in Korea to mass-produce server FCBGA.
To respond to semiconductor performance enhancement, technologies such as 2.1D package substrates that directly connect semiconductors without a silicon interposer, and co-package substrates that integrate system-on-chip (SoC) and memory on a single substrate are introduced.
Samsung Electro-Mechanics also introduces the glass core package substrate, which is attracting attention as a next-generation substrate. The glass core package substrate is a product that reduces thickness by about 40% compared to existing substrates and improves the warping and signal characteristics that occur in large-area substrates.
In the AI and Automotive Package Substrate Zone, △AI smartphone application processor (AP) flip chip chip scale package (FCCSP) △Automotive high-reliability FCBGA △AI notebook ultra-thin core (UTC) substrate △Embedded substrate with passive components are exhibited.
Eungsoo Kim, Head of Package Solution Division at Samsung Electro-Mechanics, stated, “Based on high-performance semiconductor package substrate technology, we will expand cooperation with global customers and focus on future growth markets.”

kjh0109@fnnews.com Junho Kwon Reporter