Saturday, December 13, 2025

Solving Smartphone Heating Issues... SK hynix Begins Supply of 'High-Thermal Conductivity Mobile DRAM'

Input
2025-08-28 12:59:00
Updated
2025-08-28 12:59:00
Application of 'High-K EMC' in Product Packaging
Image of SK hynix's high-thermal conductivity mobile DRAM product applying 'High-K EMC' material. Provided by SK hynix

[Financial News] SK hynix announced on the 28th that it has started supplying high-thermal conductivity mobile DRAM products applying 'High-K EMC' material to its clients, as the first in the industry. 
EMC is an essential material in semiconductor post-processing that seals and protects semiconductors from various external environments such as moisture, heat, shock, and charge, and acts as a heat dissipation path. High-K EMC is characterized by using a material with a high thermal conductivity coefficient (K) in EMC to enhance thermal conductivity. 
An SK hynix representative explained, "The heat generated during high-speed data processing for on-device artificial intelligence (AI) implementation is a major cause of smartphone performance degradation," adding, "This product solves the heating issue of high-spec flagship smartphones and is receiving high evaluations from global clients." 
The latest flagship smartphones are applying the PoP method, stacking DRAM on top of the mobile application processor (AP). This structure efficiently utilizes limited space and offers advantages in improving data processing speed. However, the heat generated from the mobile AP accumulates inside the DRAM, causing overall smartphone performance degradation.
To solve this issue, SK hynix focused on improving the thermal conductivity performance of EMC, the core material that wraps the DRAM package. They developed a new material, High-K EMC, by mixing alumina with silica, which was previously used as the EMC material.
Through this, they significantly enhanced thermal conductivity to 3.5 times the previous level, resulting in a 47% improvement in the thermal resistance of the vertical heat path.
The improved thermal dissipation performance contributes to enhancing smartphone performance and reducing power consumption, thereby extending battery life and product lifespan. Due to these effects, interest and demand for this product are expected to increase in the mobile industry.
Lee Gyu-jae, Vice President of SK hynix (in charge of PKG product development), emphasized, "This product is significant not only for its simple performance improvement but also for alleviating the inconvenience experienced by high-performance smartphone users," adding, "We will firmly establish our technological leadership in the next-generation mobile DRAM market based on material technology innovation."  

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