"Leading Next-Generation HBM Bonder" Hanmi Semiconductor Bets 100 Billion Won

[Financial News] Hanmi Semiconductor is investing a total of 100 billion won in hybrid bonding technology. Hanmi Semiconductor plans to introduce hybrid bonder equipment by the end of 2027.
Hanmi Semiconductor announced on the 25th that it will build a hybrid bonder factory with a total floor area of 14,570㎡ in the Incheon Seo-gu Juan National Industrial Complex, investing 100 billion won. The goal is to complete it in the second half of next year. With this investment, Hanmi Semiconductor will have a total production line of 89,530㎡.
Hanmi Semiconductor plans to produce △high-spec thermal compression equipment (TC bonder) for high-bandwidth memory (HBM) △fluxless bonder △big die TC bonder for artificial intelligence (AI) 2.5D packages at the hybrid bonder factory. In particular, next-generation equipment such as hybrid bonders will be produced.
Hanmi Semiconductor continues to hold the number one position in the global TC bonder market, a key equipment essential for HBM production. Recently, it signed a technology agreement with domestic semiconductor front-end equipment company TES for the development of hybrid bonders for next-generation HBM production.
The strategy is to further enhance equipment technology by adding TES's plasma and thin-film deposition technology to Hanmi Semiconductor's bonder technology. Furthermore, it is expected that the pace of technology development will accelerate by strengthening specialized personnel for hybrid bonder development.
Hanmi Semiconductor started production of the 'TC Bonder 4', a dedicated equipment for HBM4, this month. It plans to sequentially introduce related equipment in line with the next-generation HBM development and mass production roadmap of leading domestic and foreign memory semiconductor companies, including the launch of a fluxless bonder within the year.
A Hanmi Semiconductor official said, "Hybrid bonding technology is essential for improving the performance of next-generation high-stacked HBM," adding, "With proactive investment, we will continue to supply the core equipment needed for the next-generation HBM development of domestic and foreign memory semiconductor companies in a timely manner, maintaining market leadership."

butter@fnnews.com Kang Kyung-rae Reporter