Rebellion to Develop AI Chiplet for Data Centers with CoAsia Semi

Rebellion announced on the 23rd that it will develop AI chiplets and software solutions for data centers by integrating advanced packaging development technology from CoAsia Semi, a company specializing in system semiconductor design.
Rebellion and CoAsia Semi held a signing ceremony for the development and supply contract of Rebellion's next-generation AI semiconductor, Rebell-based AI chiplet, at Rebellion's headquarters in Bundang the previous day, attended by the CEOs of both companies and Lee Hee-jun, chairman of CoAsia Group. They agreed on a technology partnership and cooperation in building a global AI ecosystem.
The two companies jointly won a national project for developing multi-petaflops PIM server semiconductor chiplets last April, opening the door for technological collaboration. This joint development, which goes a step further, aims for the commercialization of products for data centers and incorporates CoAsia Semi's 2.5D silicon interposer and advanced package analysis and development manufacturing technology. This chiplet technology is considered a key technology for AI servers and HPC environments for data centers due to its excellent design flexibility, yield, power, and performance optimization compared to existing single system-on-chip (SoC) structures.
The two companies expect to complete the development and verification of the product by the end of next year and supply large-scale production quantities to domestic and international AI data centers.
This collaboration leads to the establishment of an ecosystem for targeting the global AI semiconductor market, with global leaders in the fields of OSAT and IP participating in product development. Once the comprehensive global semiconductor ecosystem of 'fabless-packaging-OSAT-IP' is completed, it will lay the foundation for the entry and expansion of AI semiconductor integrated solutions into major AI/HPC markets such as the United States, Europe, and Japan.
Rebellion plans to commercialize the enhanced AI semiconductor ATOM-Max within the year and unveil the new product REBEL-Quad, applying chiplet architecture and high-bandwidth memory (HBM3E), in the second half. The collaboration with CoAsia Semi is for the development of the Rebell product line expanded with chiplet-based REBEL-Quad, which is expected to complete the Rebell product roadmap.
Seong-hyun Park, CEO of Rebellion, said, “This collaboration is part of Rebellion's strategy to diversify AI semiconductor products to respond to the rapidly changing AI market, signaling the full utilization of Rebell's chiplet architecture and CoAsia Semi's advanced packaging capabilities,” adding, “We will build an advanced packaging ecosystem that connects not only development but also mass production and commercialization based on strategic collaboration with key partners like CoAsia Semi.”
Dong-soo Shin, CEO of CoAsia Semi (and head of the semiconductor division of CoAsia Group), said, “The strategic technological cooperation between CoAsia Semi and Rebellion, which connects design technology, advanced packaging, and software solution technology, will play a pivotal role in the AI semiconductor ecosystem,” adding, “We plan to proceed with development and mass production supply contracts with tier-1 customers in the United States soon, maintaining technological superiority in the rapidly growing AI semiconductor market.”
solidkjy@fnnews.com Reporter Koo Ja-yun