Philoptics, Continuous Shipment of Semiconductor Glass Substrate Equipment

[Financial News] Philoptics is accelerating its efforts to penetrate the semiconductor glass substrate processing equipment market.
On the 27th, according to Philoptics, following the 'Singulation' equipment in the first quarter of this year, they delivered 'Through Glass Via (TGV)' equipment to overseas companies in the second quarter. The company explained that it is difficult to disclose the customer and contract size due to a non-disclosure agreement (NDA).
The Singulation equipment delivered by Philoptics to overseas comprehensive semiconductor companies precisely cuts glass substrates into chip units. Applying this equipment allows for stable cutting without the 'seware' phenomenon, where glass lifts or tears.
Philoptics' successful delivery of display equipment, including Singulation equipment, resulted in a sales increase of about 50% in the first quarter of this year compared to the same period last year.
Philoptics has diversified its clientele from comprehensive semiconductor companies to glass material specialists by commercializing TGV equipment following Singulation equipment, thus strengthening its dominance across the entire semiconductor glass substrate value chain.
A Philoptics representative stated, "The glass substrate processing technology we have internalized since 2019 has recently led to order and shipment achievements," adding, "In addition to existing clients, we plan to add cooperation with new clients this year." They further stated, "We will solidify our market position based on excellent technology and proven track records."
Meanwhile, Philoptics recently launched TGV inspection equipment, further enhancing its semiconductor glass substrate equipment lineup. The inspection equipment is also receiving positive feedback from major clients, the company explained.

butter@fnnews.com Kang Kyung-rae